Analysis of residual stress of gradient TiAlN films prepared by arc ion plating

Shi Wei Yang*, Li Yun Zeng, Yan Hua Wang, Hai Tao Liu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

4 Citations (Scopus)

Abstract

Graded (Ti, Al)N film was prepared on 1Cr11Ni2W2MoV stainless steel by arc ion plating. High temperature oxidation experiments were carried out at 700°C and 800°C. The residual stress configuration and bonding state of gradient film were analyzed. The results show that residual stress of films decreases obviously because there are five monolayers in the gradient films. Composition of these monolayers is Ti, TiN, TV, , Al0.25N, Ti0.6Al0.4N, Ti0.5Al0.5N. The composition and structure gradients contribute to the decrease of lattice mismatch and reduction of thermal expansion coefficient misfit leading to the decrease of residual stress. At high temperature, intrinsic stress relaxes and the thermal stress changes to tensile stress. The bonding states of gradient TiAIN film at room temperature and high temperature are excellent.

Original languageEnglish
Pages (from-to)100-103
Number of pages4
JournalCailiao Rechuli Xuebao/Transactions of Materials and Heat Treatment
Volume27
Issue number3
Publication statusPublished - Jun 2006
Externally publishedYes

Keywords

  • (Ti, Al)N gradient films
  • Arc ion plating
  • Residual stress

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