An Overview of the Impact of the Temperature on the Small- and Large-Signal Performance of 0.15-μm Microwave GaN HEMTs

Giovanni Crupi*, Valeria Vadalà, Gianni Bosi, Giovanni Gugliandolo, Xiue Bao, Rocco Giofrè, Antonio Raffo, Paolo Colantonio, Nicola Donato, Giorgio Vannini

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

The goal of the present work is to study the influence of the thermal effects on the small- and large-signal characteristics of gallium nitride (GaN) high-electron-mobility transistor (HEMT) devices by using an extensive campaign of measurements. The studied devices were manufactured using a 0.15-μm process on silicon carbide (SiC) substrate. Experiments carried out on the three HEMTs with different gate widths are investigated in detail to get a thorough comprehension of how changing the backside temperature up to 100°C affects the transistor performance.

Original languageEnglish
Title of host publication2024 IEEE MTT-S International Wireless Symposium, IWS 2024 - Proceedings
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350389999
DOIs
Publication statusPublished - 2024
Event11th IEEE MTT-S International Wireless Symposium, IWS 2024 - Beijing, China
Duration: 16 May 202419 May 2024

Publication series

Name2024 IEEE MTT-S International Wireless Symposium, IWS 2024 - Proceedings

Conference

Conference11th IEEE MTT-S International Wireless Symposium, IWS 2024
Country/TerritoryChina
CityBeijing
Period16/05/2419/05/24

Keywords

  • backside temperature
  • high-power applications
  • large-signal operation
  • scattering parameter measurements
  • transistor

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