An analytical dislocation multiple-pile-up model for the yield stress of fully lamellar TiAl alloys

Jun Yang*, Gengkai Hu, Yonggang Zhang, Jilong Su

*Corresponding author for this work

Research output: Contribution to journalReview articlepeer-review

Abstract

An analytical dislocation multiple-pile-up model for yield stress of fully lamellar TiAl alloys was proposed. Numerical simulations showed that even when the grain size was fixed, different distributions of lamella sizes of different thickness influenced the yield stress. The proposed model agrees with the experimental results for fully lamellar TiAl alloys for relatively large lamellar thickness.

Original languageEnglish
Pages (from-to)627-634
Number of pages8
JournalModelling and Simulation in Materials Science and Engineering
Volume11
Issue number4
DOIs
Publication statusPublished - Jul 2003

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