Achieving ultra-high performance after thermal exposure temperature for Al-Cu alloys by stabilizing nano θ′ precipitates and diversifying micro-compounds with Sc and Li

Xinghai Yang, Junsheng Wang*, Xingxing Li, Chengpeng Xue, Quan Li, Yisheng Miao

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

1 Citation (Scopus)

Abstract

Al-Cu alloys are widely used on aircrafts due to their excellent fracture toughness and fatigue behaviour even at 200 °C. However, prolonged exposure at high temperature over 200 °C leads to rapid degradation of their strength, which limits their application on larger and faster airplanes. To overcome this limitation, this study designs an advanced Al-Cu-Li-Sc alloy, which incorporates not only such traditional transitional heat-resistant elements as Ti, Zr, Mn, and Cr, but also propose a new heat treatment strategy for Sc and Li alloying in order to stabilize nano θ′ precipitates and promoting the formation of micro-compounds at elevated temperatures. The addition of Li enhances the formation of a higher fraction of micron-scale secondary phases, including the co-segregation of Mn and Sc. The new Al-Cu-Li-Sc alloy demonstrates exceptional high-temperature performance, retaining a tensile strength of 302 MPa after 100 h of exposure at 300 °C, which substantially surpasses the performance of conventional Al-Cu-based alloys. The enhanced thermal resistance can primarily be attributed to the improved heat resistance of multi-scale phases within the alloy, as well as the unique three-dimensional orientation characteristics of nanophases with multi-configurational features. These factors collectively provide superior dislocation obstruction compared to single-phase strengthening mechanisms.

Original languageEnglish
Article number179768
JournalJournal of Alloys and Compounds
Volume1022
DOIs
Publication statusPublished - 10 Apr 2025

Keywords

  • Al-Cu-Li alloy
  • Heat-resistant
  • Multi-scale phase
  • Solute segregation
  • Thermal stability

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