A robust lateral shift free (LSF) electrothermal micromirror with flexible multimorph beams

Electrothermal bimorph-based scanning micromirrors typically employ standard silicon dioxide (SiO₂) as the electrothermal isolation material. However, due to the brittle nature of SiO₂, such micromirrors may be incapable to survive even slight collisions, which greatly limits their application range. To improve the robustness of electrothermal micromirrors, a polymer material is incorporated and partially replaces SiO₂ as the electrothermal isolation and anchor material. In particular, photosensitive polyimide (PSPI) is used, which also simplifies the fabrication process. Here, PSPI-based electrothermal micromirrors have been designed, fabricated, and tested. The PSPI-type micromirrors achieved an optical scan angle of ±19.6° and a vertical displacement of 370 μm at only 4 Vdc. With a mirror aperture size of 1 mm × 1 mm, the PSPI-type micromirrors survived over 200 g accelerations from either vertical or lateral directions in impact experiments. In the drop test, the PSPI-type micromirrors survived falls to a hard floor from heights up to 21 cm. In the standard frequency sweeping vibration test, the PSPI-type micromirrors survived 21 g and 29 g acceleration in the vertical and lateral vibrations, respectively. In all these tests, the PSPI-type micromirrors demonstrated at least 4 times better robustness than SiO₂-type micromirrors fabricated in the same batch. [Figure not available: see fulltext.]