A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

Lingyao Sun; Zhenhua Guo; Xiuchen Zhao; Ying Liu; Kingning Tu; Yingxia Liu

doi:10.3390/mi13060867

A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

Lingyao Sun, Zhenhua Guo, Xiuchen Zhao, Ying Liu, Kingning Tu, Yingxia Liu^*

^*Corresponding author for this work

School of Material Science and Engineering

Research output: Contribution to journal › Article › peer-review

8 Citations (Scopus)

Abstract

We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140^◦C for 5 min. The wetting angle of the mixed solder joint is 17.55^◦. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80^◦C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.

Original language	English
Article number	867
Journal	Micromachines
Volume	13
Issue number	6
DOIs	https://doi.org/10.3390/mi13060867
Publication status	Published - Jun 2022

Keywords

3D IC
Bi aggregation
Sn-Bi solder
low-temperature soldering

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10.3390/mi13060867

Cite this

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title = "A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly",

abstract = "We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140◦C for 5 min. The wetting angle of the mixed solder joint is 17.55◦. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80◦C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.",

keywords = "3D IC, Bi aggregation, Sn-Bi solder, low-temperature soldering",

author = "Lingyao Sun and Zhenhua Guo and Xiuchen Zhao and Ying Liu and Kingning Tu and Yingxia Liu",

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doi = "10.3390/mi13060867",

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volume = "13",

journal = "Micromachines",

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T1 - A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

AU - Sun, Lingyao

AU - Guo, Zhenhua

AU - Zhao, Xiuchen

AU - Liu, Ying

AU - Tu, Kingning

AU - Liu, Yingxia

PY - 2022/6

Y1 - 2022/6

N2 - We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140◦C for 5 min. The wetting angle of the mixed solder joint is 17.55◦. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80◦C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.

AB - We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140◦C for 5 min. The wetting angle of the mixed solder joint is 17.55◦. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80◦C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.

KW - 3D IC

KW - Bi aggregation

KW - Sn-Bi solder

KW - low-temperature soldering

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A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

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Keywords

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