@inproceedings{f2b9ca0cf00f4f6d867d5b09a8deb096,
title = "A LTCC power amplifier for a Ku-band transmitter module",
abstract = "A power amplifier utilizing multilayer Low temperature co-fired ceramic (LTCC) substrates for a Ku-band transmitter module is presented. The disposition of the thru-plane thermal vias for heat dissipation is analyzed and the heat spreading capability of the entire substrate is calculated. A full passive model of the power amplifier is proposed and simulation in a full-wave EM solver is performed. The power amplifier shows a measured gain of 30.4dB and a 1dB compression output power of 28.2dBm at 16GHz. Good agreement between the simulated and measured results was achieved. The measured results validate the accuracy of the passive model. RF-unfriendly DC lines for the power amplifier in a transmitter module are proposed for future use.",
keywords = "DC lines, Heat dissipation, LTCC, Power amplifier, RF-unfriendly, Via arrays",
author = "Anhua Ji and Yinqiao Li and Jianming Zhou and Yuanchun Fei",
year = "2009",
doi = "10.1109/MAPE.2009.5355878",
language = "English",
isbn = "9781424440740",
series = "Proceedings - 2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2009",
pages = "319--322",
booktitle = "Proceedings - 2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2009",
note = "2009 3rd IEEE International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications, MAPE 2009 ; Conference date: 27-10-2009 Through 29-10-2009",
}