@inproceedings{570cdb01b67149a0bd650ab72603bc40,
title = "A highly integrated chipset for 40 Gbps wireless D-band communication based on a 250 nm InP DHBT technology",
abstract = "A highly integrated chipset comprising a transmitter (TX) and a receiver (RX) chip, based on a 250 nm InP DHBT technology for high data rate D-band (110-170 GHz) wireless communication is described. The chipset is designed for point-to-point wireless communication for 4G and 5G mobile communication infrastructure, high data rate backhaul, low-latency wireless HDTV transmission and >40 Gbps transmission over dielectric waveguide. The measured RX conversion gain is 26 dB, with a noise figure of 9 dB. The measured TX conversion gain is 20 dB. A maximum QPSK data rate of 44 Gbps is demonstrated, which exceeds the present state-of-the art in the D-band by a factor of 2.",
keywords = "BPSK, D-band, InP DHBT, QPSK, RX/TX, Wireless communication",
author = "Sona Carpenter and Zhongxia He and Mingquan Bao and Herbert Zirath",
note = "Publisher Copyright: {\textcopyright} 2014 IEEE.; 36th IEEE Compound Semiconductor Integrated Circuit Symposium, CSICS 2014 ; Conference date: 19-10-2014 Through 22-10-2014",
year = "2014",
month = dec,
day = "5",
doi = "10.1109/CSICS.2014.6978535",
language = "English",
series = "Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC",
publisher = "Institute of Electrical and Electronics Engineers Inc.",
booktitle = "Technical Digest - IEEE Compound Semiconductor Integrated Circuit Symposium, CSIC",
address = "United States",
}