TY - GEN
T1 - A High-Load Large-Stroke MEMS Micro-motion Platform Based on Polyimide/Al Bimorph for Optical Image Stabilization
AU - Chen, Jingyi
AU - Li, Zonghao
AU - Yang, Hengzhang
AU - Mao, Xiaodan
AU - Yu, Leqi
AU - Jiang, Senlin
AU - Xie, Huikai
N1 - Publisher Copyright:
© 2026 IEEE.
PY - 2026
Y1 - 2026
N2 - This paper presents a novel micro-motion platform for optical image stabilization (OIS) and autofocus, featuring a platform that directly manipulates a CMOS image sensor (CIS). Based on the electrothermal actuation, the micro-motion platform has three-degree-of-freedom movement via parallel PSPI/Al lateral-shift-free (LSF) actuators around the platform. This design achieves simultaneous high-load capacity and large stroke - critical for moving image sensor chips - while maintaining low driving voltage. Its capacity to combine excellent loading performance with large displacement is demonstrated by its displacement of 240 μm when unloaded, 286 μm when supporting a CIS chip, and 320 μm when supporting an 80 mg load at 20 Vdc. Ultimately, through the imaging experiment of actively compensating for defocus blur by sensor displacement, the practical functions of this device's multi-axis image stabilization are verified. This work provides a key device design and integration process foundation for the development of the next generation of high-performance and miniaturized imaging systems.
AB - This paper presents a novel micro-motion platform for optical image stabilization (OIS) and autofocus, featuring a platform that directly manipulates a CMOS image sensor (CIS). Based on the electrothermal actuation, the micro-motion platform has three-degree-of-freedom movement via parallel PSPI/Al lateral-shift-free (LSF) actuators around the platform. This design achieves simultaneous high-load capacity and large stroke - critical for moving image sensor chips - while maintaining low driving voltage. Its capacity to combine excellent loading performance with large displacement is demonstrated by its displacement of 240 μm when unloaded, 286 μm when supporting a CIS chip, and 320 μm when supporting an 80 mg load at 20 Vdc. Ultimately, through the imaging experiment of actively compensating for defocus blur by sensor displacement, the practical functions of this device's multi-axis image stabilization are verified. This work provides a key device design and integration process foundation for the development of the next generation of high-performance and miniaturized imaging systems.
KW - electrothermal actuator
KW - high load
KW - lateral-shift-free (LSF)
KW - optical image stabilization (OIS)
UR - https://www.scopus.com/pages/publications/105047808127
U2 - 10.1109/NEMS69704.2026.11633702
DO - 10.1109/NEMS69704.2026.11633702
M3 - Conference contribution
AN - SCOPUS:105047808127
T3 - 2026 IEEE 21st International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2026
SP - 296
EP - 300
BT - 2026 IEEE 21st International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2026
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 21st IEEE International Conference on Nano/Micro Engineered and Molecular Systems, NEMS 2026
Y2 - 17 April 2026 through 21 April 2026
ER -