A case study of intermetallic evolutions in a solder joint under electromigration using a novel experiment-simulation combined approach

Haiyang Yuan, Ce Li, Zhaolong Ma*, Huizhe Zhang, Mengzhuo Fan

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

In this work, by using high-resolution X-ray computed tomography (μ-XCT), we revealed the 3D Cu6Sn5 evolutions in a typical single-crystal solder joint during electromigration (EM), and the finite element modeling (FEM) based on a reconstructed real solder joint model was performed to understand the microstructure evolution mechanism. Simulation results show that the migration direction of Cu atoms is nearly parallel with the c-axis of βSn. Primary Cu6Sn5 rods within the region of higher Cu diffusion flux exhibit more obvious growth with higher volume change. Compared with the grown primary Cu6Sn5, the most ungrown Cu6Sn5 rods demonstrate higher angles θc between [001]βSn and [0001]Cu6Sn5 (>38°). The abnormally less growth of low-θc Cu6Sn5 can be attributed to the chaotic Cu diffusion flux in the neighboring region that is the result of the complex geometry of the solder joint. The formations of new Cu6Sn5 rods within the solder joint are influenced by the Cu6Sn5-βSn orientation relationship, with small angles (<20°) between [0001]Cu6Sn5 with (112)βSn. The formation of Cu6Sn5 particles at the specific area of the anode interface is consistent with the local higher Cu concentration, as indicated by the simulation results.

Original languageEnglish
Title of host publication2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023
PublisherInstitute of Electrical and Electronics Engineers Inc.
ISBN (Electronic)9798350338812
DOIs
Publication statusPublished - 2023
Event24th International Conference on Electronic Packaging Technology, ICEPT 2023 - Shihezi City, China
Duration: 8 Aug 202311 Aug 2023

Publication series

Name2023 24th International Conference on Electronic Packaging Technology, ICEPT 2023

Conference

Conference24th International Conference on Electronic Packaging Technology, ICEPT 2023
Country/TerritoryChina
CityShihezi City
Period8/08/2311/08/23

Keywords

  • 3D reconstruction
  • Crystal orientation
  • Electromigration
  • Finite element modeling
  • Micro-XCT

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