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A bulk micromachined cantilever array for uncooled infrared imaging

  • Yuliang Yi
  • , Shenglin Ma
  • , Xiaomei Yu*
  • , Ming Liu
  • , Xiaohua Liu
  • *Corresponding author for this work
  • Peking University
  • Beijing Institute of Technology

Research output: Chapter in Book/Report/Conference proceedingConference contributionpeer-review

Abstract

This paper presents a bi-material microcantilever focal plane array (FPA) for uncooled infrared (IR) imaging. The FPA was fabricated by a bulk silicon micromachining method with substrate silicon selectively removed by deep reactive ion etching (DRIE) technique at the area where each cantilever pixel is located. The absorbance of the IR radiation can be improved by 48% due to the selective removal of the substrate, and hence the noise equivalent temperature difference (NETD) of the FPA can be reduced by 32% compared to the one fabricated by sacrificial layer technique, approaching 60mK. The thermomechanical sensitivity and the response time of the FPA were measured and calculated to be 112nm/K and 15ms, respectively. An image of human bodies was captured by an optical readout method.

Original languageEnglish
Title of host publication2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
Pages129-132
Number of pages4
DOIs
Publication statusPublished - 2008
Event2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008 - Kowloon, Hong Kong
Duration: 3 Jun 20085 Jun 2008

Publication series

Name2008 Proceedings of the ASME - 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008

Conference

Conference2008 ASME 2nd International Conference on Integration and Commercialization of Micro and Nanosystems, MicroNano 2008
Country/TerritoryHong Kong
CityKowloon
Period3/06/085/06/08

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