A Broadband and Low-loss Packaging Technique Using Beam-leads Interconnection

This paper presents a broadband, low-loss wave-guide-to-chip transition for monolithic microwave integrated circuit packaging. By introducing a secondary probe perpendicular to the traditional E-plane probe, a cross-probe structure is formed, substantially improving coupling efficiency. The probe and chip are interconnected using beam-lead technology, which reduces parasitic effects and broadens operational bandwidth. To validate this concept, an amplifier module employing this packaging technique was designed, fabricated, and tested. The experimental results agree well with the datasheet of the chip. Across the entire D-band, the measured small-signal gain ranges from 15.1 to 20 dB, while the calculated average insertion loss per transition remains below 0.7 dB.