TY - GEN
T1 - A 3-D minimum-order boundary integral equation technique to extract frequency-dependent inductance and resistance in ULSI
AU - Fang, Shuzhou
AU - Wang, Zeyi
AU - Hong, Xianlong
N1 - Publisher Copyright:
© 2002 IEEE.
PY - 2002
Y1 - 2002
N2 - The frequency-dependent resistance and inductance can be calculated by solving an eddy current problem. In this paper, a model to describe such a 3D eddy current problem is proposed, called the 3D Omni-A model because both the conducting and nonconducting regions are described in terms of magnetic vector potential A. Therefore, the induced voltages of the conductors may appear as the unknowns directly in the boundary integral equations (BIE). Compared with popular coupled circuit methods, the computational method based on the 3D Omni-A model has two advantages. First, it does not fix the current direction along the axis of conductor, so in this method the perpendicular conductors may have mutual impedance. It could be more accurate in deep submicron (0.1 μm) chips at high speed (10 GHz). Secondly, it only discretizes the surfaces of the conductor, so it can be more efficient.
AB - The frequency-dependent resistance and inductance can be calculated by solving an eddy current problem. In this paper, a model to describe such a 3D eddy current problem is proposed, called the 3D Omni-A model because both the conducting and nonconducting regions are described in terms of magnetic vector potential A. Therefore, the induced voltages of the conductors may appear as the unknowns directly in the boundary integral equations (BIE). Compared with popular coupled circuit methods, the computational method based on the 3D Omni-A model has two advantages. First, it does not fix the current direction along the axis of conductor, so in this method the perpendicular conductors may have mutual impedance. It could be more accurate in deep submicron (0.1 μm) chips at high speed (10 GHz). Secondly, it only discretizes the surfaces of the conductor, so it can be more efficient.
UR - http://www.scopus.com/inward/record.url?scp=84962312589&partnerID=8YFLogxK
U2 - 10.1109/ASPDAC.2002.994939
DO - 10.1109/ASPDAC.2002.994939
M3 - Conference contribution
AN - SCOPUS:84962312589
T3 - Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002
SP - 305
EP - 310
BT - Proceedings - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 7th Asia and South Pacific Design Automation Conference, 15th International Conference on VLSI Design, ASP-DAC/VLSI Design 2002
Y2 - 7 January 2002 through 11 January 2002
ER -