非理想表面胶接装配的位姿偏差计算方法及其应用

Computation of position and orientation deviations(PODs) is a core issue in assembly accuracy prediction. Existing approaches primarily address PODs caused by initial surface positioning but seldom consider the effects of adhesive bonding processes. This limitation leads to predictions of assembly accuracy in precision structures failing to accurately align with actual assembly results. To address this, a novel two-stage approach is proposed, accounting for PODs from non-ideal surface positioning and adhesive bonding. In the initial positioning stage, a pose probing adjustment strategy is employed to sequentially constrain assembly degrees of freedom, thereby determining the initial positioning PODs. In the bonding stage, a coupled thermal-mechanical-curing finite element model is established to analyze the deformation induced by adhesive shrinkage during curing. The final PODs are determined using least-squares fitting. The effectiveness of the proposed approach is experimentally validated. Besides, this approach is implemented in predicting the coaxial assembly pose accuracy of a key quartz accelerometer component. Results revealed that the adhesive bonding process significantly affects PODs, highlighting its non-negligible impact. This study enhances the framework for assembly accuracy prediction and offers a reference for multi-stage assembly processes.