金属纳米线的制备及其在电子材料中的应用

Translated title of the contribution: Preparation and applications in electronic materials of metallic nanowires

Qing Liu, Xiaofeng Dai, Teng Zhang, Hongbin Shi, Yabing Zhang, Tao Wang*

*Corresponding author for this work

Research output: Contribution to journalReview articlepeer-review

4 Citations (Scopus)

Abstract

As the development of integration and flexibility of electronic devices, the traditional tin-lead solders, indium tin oxide (ITO) films and other materials no longer meet the requirements of properties, such as electric conductivity, thermal conductivity and flexibility. Metallic nanowires have excellent photoelectric properties and unique one-dimensional structure. New materials with them as key components have become the most potential substitutes for traditional electronic materials. The commercialization of metallic nanowires involves the aspects of raw material, equipment, process and application. However, the key technique lies in the large-scale, low-cost, green and efficient preparation of metallic nanowires. In this paper, the preparation methods of metallic nanowires are reviewed, including physical vapor deposition, chemical vapor deposition, template assisted, solvothermal process and polyol method. The applications of metallic nanowires in the field of electronic materials, such as conductive adhesives, transparent conductive films and thermal interface materials are summarized.

Translated title of the contributionPreparation and applications in electronic materials of metallic nanowires
Original languageChinese (Traditional)
Pages (from-to)681-708
Number of pages28
JournalHuagong Xuebao/CIESC Journal
Volume72
Issue number2
DOIs
Publication statusPublished - Feb 2021
Externally publishedYes

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