Abstract
Numerical simulation of the vapour phase soldering process used in the integration of electronic devices and circuit boards in aerospace field is of great significance to revealing the fluid state in the vapor phase reflow oven, clarifying the heat transfer mechanism, optimizing the soldering parameters, and revealing the temperature distribution of the soldering circuit boards. A numerical simulation method for the simulation of vapour phase solering process was proposed. The complete model of vapor phase reflow oven was established. The fluid state in the reflow oven and the heat transfer mechanism between the fluid and the circuit board were analyzed. And the equivalent simulation model of a single steam layer was established by taking the temperature calculation results of the complete model as the boundary condition. By setting the pressure difference to control the temperature transfer rate, the equivalent model with circuit board was calculated to predict the temperature change of the soldering circuit board. Finally, design experiments to compare and verify the correctness of the model. The results show that the equivalent model is accurate in simulating the temperature distribution of circuit board, and is of great significance to optimizing the soldering parameters.
| Translated title of the contribution | Numerical Simulation Study of Heat Transfer Mechanisms and Equivalent Model in Vapour Phase Soldering Integrated Process for Aerospace Printed Circuit Board |
|---|---|
| Original language | Chinese (Traditional) |
| Pages (from-to) | 60-66 |
| Number of pages | 7 |
| Journal | Beijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology |
| Volume | 45 |
| Issue number | 1 |
| DOIs | |
| Publication status | Published - Jan 2025 |