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基于增材制造陶瓷点阵的双相网络互穿复合材料的研究进展与挑战

Translated title of the contribution: Additively Manufactured Ceramic Lattice-based Interpenetrating Phase Composites: Progress and Challenges
  • Beijing Institute of Technology
  • Taiyuan University of Technology

Research output: Contribution to journalArticlepeer-review

Abstract

Interpenetrating phase composites (IPCs), which achieve a continuous interpenetration of porous ceramic skeletons and polymer or metal phases in 3D space, have opened up a new way to overcome the brittleness of ceramics and given new possibilities for the development of next-generation impact-resistant and damage-tolerant advanced ceramics. Additive manufacturing (AM) provides support for the controllable preparation of IPCs. Hence, this paper systematically reviews the progress of additively manufactured ceramic lattice-based IPCs. Firstly, AM processes such as vat photopolymerization, powder bed fusion, material extrusion, and binder jetting are introduced, with their respective technical characteristics and scope of application. Next, ceramic lattice structures, such as honeycomb, truss, plate lattice, and shell structures, are discussed as well as their unique advantages in mechanical properties. Then, core composite processes including infiltration and electrodeposition of two key IPC systems, polymer/ceramic and metal/ceramic IPCs, are provided, and the effects of key parameters such as structural configuration, volume fraction, and gradient design on their mechanical properties are summarized. Finally, based on the current research status, the challenges and opportunities in terms of composite processes, multi-scale structural design, and multifunctional integration are further analyzed and forecasted.

Translated title of the contributionAdditively Manufactured Ceramic Lattice-based Interpenetrating Phase Composites: Progress and Challenges
Original languageChinese (Traditional)
Pages (from-to)849-866
Number of pages18
JournalWuji Cailiao Xuebao/Journal of Inorganic Materials
Volume41
Issue number7
DOIs
Publication statusPublished - Jul 2026

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