圆筒型陶瓷-钛合金-芳纶三单元层复合靶板结构抗弹性能数值模拟及其内在机理

Translated title of the contribution: Ballistic Performance Simulation of Cylindrical Ceramic/ Titanium/Aramid Three-Layered Composite Targets and the Underlying Mechanism

Qun Bo Fan, Peng Ru Li*, Yu Zhou, Xin Liu

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)

Abstract

Focusing on the process of the 53 type 7.62 mm armour-piercing projectile penetrating into the cylindrical ceramic/titanium/aramid three-layered composite targets, a study on ballistic performance numerical simulation was carried out. The simulation results show that the vertical incidence of projectile can cause cracks and fragmentations of ceramic layer, and eventually form pits on the titanium layer. The penetration depth of composite targets well agree with the experimental result, the relative error is only 9.4%. The percentages of energy dissipated by ceramic, titanium alloy and aramid layers are 83.77%, 13.77% and 2.46%, respectively. On this basis, setting the initial incident attitude angle θ0 from 0° to 70°, it is found that the ratio of energy dissipated by ceramic layer to the total energy is the largest in the process of projectile penetrating into targets. Further analysis of the ceramic layer shows that with the increase of initial incident attitude angle θ0, the maximum force of ceramic layer decreases. Moreover, the action modes of projectile and target vary with the initial incident attitude angle. Energy analysis of ceramic layer shows that, the action mode is basically consistent with the mass loss. However, when θ0 is 30°, the mass loss of ceramic layer is large, but the dissipated energy is relatively less.

Translated title of the contributionBallistic Performance Simulation of Cylindrical Ceramic/ Titanium/Aramid Three-Layered Composite Targets and the Underlying Mechanism
Original languageChinese (Traditional)
Pages (from-to)219-226
Number of pages8
JournalBeijing Ligong Daxue Xuebao/Transaction of Beijing Institute of Technology
Volume40
Issue number2
DOIs
Publication statusPublished - 1 Feb 2020

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