低阻硅TSV与铜TSV的热力学变参分析

Translated title of the contribution: Impact of Dimensions on Thermal-Mechanical Reliability of Low Resistivity Silicon-TSVs and Copper TSVs

Zhi Ming Chen, Yi Xie, Shi Wei Wang, Si Qi Yu

Research output: Contribution to journal › Article › peer-review

1 Citation (Scopus)

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Engineering

Material Science