Material Science
Nucleation
100%
Solder Joint
88%
High Entropy Alloys
81%
Tin
59%
Intermetallics
51%
Solidification
43%
Cobalt
40%
Thin Films
39%
Grain Refinement
36%
Single Crystal
35%
Mechanical Strength
32%
Magnetron Sputtering
31%
Yield Stress
30%
Density
26%
Medium-Entropy Alloy
19%
Bulk Metallic Glass
19%
Thermoelectric Materials
19%
Crystalline Material
18%
Electromigration
17%
Fracture Toughness
16%
Lead-Free Solder
16%
Oxidation Resistance
14%
Mechanical Property
14%
Ferroelectricity
13%
Ferroelectric Material
13%
Solid Solution
13%
Ultimate Tensile Strength
13%
Oxidation Reaction
12%
Volume Fraction
11%
Strain Rate
11%
Dielectric Property
11%
Anisotropy
11%
Crystal Microstructure
10%
Electron Backscatter Diffraction
10%
Scanning Electron Microscopy
9%
Silicide
9%
Creep Property
9%
Heterojunction
9%
Shape Memory Effect
9%
Coaxial Cable
9%
Sintering
9%
Aluminum
9%
Oxide Compound
9%
Tensile Property
9%
Tantalum
9%
Yttrium
9%
Garnet
9%
Shock Loads
9%
Damage Evolution
9%
Compressive Strength
9%
Engineering
Thin Films
29%
Microstructure
29%
Magnetron
21%
Dielectrics
15%
Joints (Structural Components)
14%
Heterostructures
9%
Eutectoids
9%
Coaxial Cable
9%
Outer Conductor
9%
Plating Process
9%
Impact Toughness
9%
Foil Thickness
9%
Room Temperature
9%
Yttrium-Aluminum-Garnet
9%
Tensile Property
9%
Energetics
9%
Compressive Strength
9%
Grain Orientation
9%
Ultimate Tensile Strength
8%
Promising Candidate
8%
Indentation
7%
Intermetallics
6%
Peritectic Reaction
6%