Interaction between HMX and dendritic bonding agent

Bi Feng Pan; Yun Jun Luo; Hui Min Tan

Interaction between HMX and dendritic bonding agent

Bi Feng Pan^*, Yun Jun Luo, Hui Min Tan

^*此作品的通讯作者

材料学院

Beijing Institute of Technology

科研成果: 期刊稿件 › 文章 › 同行评审

8 引用（Scopus）

摘要

A dendritic bonding agent (DBA) that can adhere to HMX filler is successfully reported. The coating properties are characterized by Micro infrared and X-ray photoelectron spectroscopy (XPS). The adhesive degree can be up to 100% from XPS analysis, the adhesive degree increases by increasing of CN group content. The results indicate that H-bond and induction effect are formed between DBA and -NO₂ groups. So DBA is proved to be a kind of valid bonding agent for HMX.

源语言	英语
页（从-至）	25
页数	1
期刊	Huozhayao Xuebao/Chinese Journal of Explosives and Propellants
卷	27
期	3
出版状态	已出版 - 2004

其它文件与链接

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引用此

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title = "Interaction between HMX and dendritic bonding agent",

abstract = "A dendritic bonding agent (DBA) that can adhere to HMX filler is successfully reported. The coating properties are characterized by Micro infrared and X-ray photoelectron spectroscopy (XPS). The adhesive degree can be up to 100% from XPS analysis, the adhesive degree increases by increasing of CN group content. The results indicate that H-bond and induction effect are formed between DBA and -NO2 groups. So DBA is proved to be a kind of valid bonding agent for HMX.",

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author = "Pan, {Bi Feng} and Luo, {Yun Jun} and Tan, {Hui Min}",

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T1 - Interaction between HMX and dendritic bonding agent

AU - Pan, Bi Feng

AU - Luo, Yun Jun

AU - Tan, Hui Min

PY - 2004

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N2 - A dendritic bonding agent (DBA) that can adhere to HMX filler is successfully reported. The coating properties are characterized by Micro infrared and X-ray photoelectron spectroscopy (XPS). The adhesive degree can be up to 100% from XPS analysis, the adhesive degree increases by increasing of CN group content. The results indicate that H-bond and induction effect are formed between DBA and -NO2 groups. So DBA is proved to be a kind of valid bonding agent for HMX.

AB - A dendritic bonding agent (DBA) that can adhere to HMX filler is successfully reported. The coating properties are characterized by Micro infrared and X-ray photoelectron spectroscopy (XPS). The adhesive degree can be up to 100% from XPS analysis, the adhesive degree increases by increasing of CN group content. The results indicate that H-bond and induction effect are formed between DBA and -NO2 groups. So DBA is proved to be a kind of valid bonding agent for HMX.

KW - Dendritic bonding agent

KW - HMX

KW - NEPE propellant

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ER -

Interaction between HMX and dendritic bonding agent

摘要

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