High performance integrated passive devices (ipds) on low cost through silicon interposer (LC-TSI)

Cheng Jin, Boyu Zheng, Liang Ding, Rui Li, Kafai Chang

科研成果: 书/报告/会议事项章节会议稿件同行评审

2 引用 (Scopus)

摘要

This paper presents the design, fabrication and characterization of integrated passive devices (IPDs) on low cost through silicon interposer (LC-TSI). The performance of symmetrical spiral inductors is presented and analyzed in this paper. The effect of space between traces and the width of the trace on the Q-factor are studied. In addition, the inductors with TSV around and under are also discussed. On the TSI platform, some radio-frequency (RF) IPDs are also designed, including a millimeter-wave (mmWave) antenna working at 77 GHz for the automotive radar application. A bandpass filter based on the quarter-mode substrate integrated waveguide (QMSIW) is also designed on the TSI platform. The performance of these structures is given and the results show that the TSI platform is an attractive and promising method as a carrier to design IPDs and RF-IPD working at high frequency.

源语言英语
主期刊名Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
840-843
页数4
DOI
出版状态已出版 - 2013
已对外发布
活动2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013 - Singapore, 新加坡
期限: 11 12月 201313 12月 2013

出版系列

姓名Proceedings of the 2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013

会议

会议2013 IEEE 15th Electronics Packaging Technology Conference, EPTC 2013
国家/地区新加坡
Singapore
时期11/12/1313/12/13

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