@inproceedings{44f8af08eaa6408a8fd5d6eca09acf0c,
title = "Effect of bump shape on current density and temperature distributions in solder bump joints under electromigration",
abstract = "Three dimensional thermo-electrical finite element analysis was employed to simulate the current density and temperature distributions for solder bump joints with different bump shapes. Mean-time-to-failure (MTTF) of electromigration was discussed. It was found that as the bump volume increased from hourglass bump to barrel bump, the maximum current density increased but the maximum temperature decreased. Hourglass bump with waist radius of 240 μm has the longest MTTF.",
keywords = "Bump shape, Electromigration, MTTF",
author = "Yi Li and Xiuchen Zhao and Ying Liu and Hong Li",
year = "2012",
doi = "10.4028/www.scientific.net/AMR.569.82",
language = "English",
isbn = "9783037854808",
series = "Advanced Materials Research",
pages = "82--87",
booktitle = "Advanced Materials Design and Mechanics",
note = "2012 International Conference on Advanced Materials Design and Mechanics, ICAMDM 2012 ; Conference date: 05-06-2012 Through 07-06-2012",
}