A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

Lingyao Sun; Zhenhua Guo; Xiuchen Zhao; Ying Liu; Kingning Tu; Yingxia Liu

doi:10.3390/mi13060867

A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

Lingyao Sun, Zhenhua Guo, Xiuchen Zhao, Ying Liu, Kingning Tu, Yingxia Liu^*

^*此作品的通讯作者

材料学院

科研成果: 期刊稿件 › 文章 › 同行评审

7 引用（Scopus）

摘要

We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140^◦C for 5 min. The wetting angle of the mixed solder joint is 17.55^◦. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80^◦C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.

源语言	英语
文章编号	867
期刊	Micromachines
卷	13
期	6
DOI	https://doi.org/10.3390/mi13060867
出版状态	已出版 - 6月 2022

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title = "A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly",

abstract = "We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140◦C for 5 min. The wetting angle of the mixed solder joint is 17.55◦. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80◦C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.",

keywords = "3D IC, Bi aggregation, Sn-Bi solder, low-temperature soldering",

author = "Lingyao Sun and Zhenhua Guo and Xiuchen Zhao and Ying Liu and Kingning Tu and Yingxia Liu",

note = "Publisher Copyright: {\textcopyright} 2022 by the authors. Licensee MDPI, Basel, Switzerland.",

year = "2022",

month = jun,

doi = "10.3390/mi13060867",

language = "English",

volume = "13",

journal = "Micromachines",

issn = "2072-666X",

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T1 - A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

AU - Sun, Lingyao

AU - Guo, Zhenhua

AU - Zhao, Xiuchen

AU - Liu, Ying

AU - Tu, Kingning

AU - Liu, Yingxia

PY - 2022/6

Y1 - 2022/6

N2 - We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140◦C for 5 min. The wetting angle of the mixed solder joint is 17.55◦. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80◦C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.

AB - We successfully achieved low-temperature assembly by reflowing the 13.5Sn-37.5Bi-45In-4Pb quaternary eutectic solder paste and the SAC 305 solder ball together at 140◦C for 5 min. The wetting angle of the mixed solder joint is 17.55◦. The overall atomic percent of Pb in the mixed solder joint is less than 1%, which can be further reduced or eliminated. Moreover, after aging at 80◦C for 25 days, we observed no obvious decrease in shear strength of the fully mixed solder joint, which is the most advantage of this assembly technique over Sn58Bi solder assembly. The Bi phase segregation at the interface is slowed down compared with Sn-Bi solder joint. This low-temperature assembly is promising to be applied in advanced packaging technology to replace the eutectic Sn-Bi solder.

KW - 3D IC

KW - Bi aggregation

KW - Sn-Bi solder

KW - low-temperature soldering

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U2 - 10.3390/mi13060867

DO - 10.3390/mi13060867

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ER -

A New Low-Temperature Solder Assembly Technique to Replace Eutectic Sn-Bi Solder Assembly

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