Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards

Wenqing Wang; Jacob Meyer; Qingxuan Zeng; Mingyu Li; Bita Vaezian; James Economy

doi:10.1002/pat.3833

Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards

Wenqing Wang, Jacob Meyer, Qingxuan Zeng^*, Mingyu Li, Bita Vaezian, James Economy

^*Corresponding author for this work

School of Mechatronical Engineering

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

Abstract

Copper foils are the vital elements used in microelectronic devices. Adequate adhesion between copper foils to various substrates, such as Si, SiO₂ and polyimide, is crucial to functional electronic devices. Liquid-crystalline polymers (LCPs) can be used as substrates for these modules as well as the adhesive to copper foils. The adhesion between aromatic thermosetting copolyester (ATSP)/fiberglass fabric (GF) laminates and copper foils was characterized by peel strength tests. It was found that ATSP/GF laminates with copper foil using ATSP oligomers as adhesive showed a highest average peel strength of 711 N · m⁻¹. Scanning electron microscope (SEM) and Fourier Transform Infrared Spectroscopy (FTIR) showed an excellent bond between the composite and the copper foil interface. Failure occurred between the backside of the copper foil and the ATSP/GF laminates in the peeling test and the mechanism is discussed. Thermogravimetic analyzer (TGA) indicated a thermal stability up to 371°C for ATSP/GF composite substrate and a glass transition temperature of over 400°C as determined by peak in tan δ during Dynamic Mechanical Analysis (DMA).

Original language	English
Pages (from-to)	1577-1585
Number of pages	9
Journal	Polymers for Advanced Technologies
Volume	27
Issue number	12
DOIs	https://doi.org/10.1002/pat.3833
Publication status	Published - 1 Dec 2016

Keywords

adhesive strength
aromatic thermosetting copolyesters
circuit boards
copper foil

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title = "Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards",

abstract = "Copper foils are the vital elements used in microelectronic devices. Adequate adhesion between copper foils to various substrates, such as Si, SiO2 and polyimide, is crucial to functional electronic devices. Liquid-crystalline polymers (LCPs) can be used as substrates for these modules as well as the adhesive to copper foils. The adhesion between aromatic thermosetting copolyester (ATSP)/fiberglass fabric (GF) laminates and copper foils was characterized by peel strength tests. It was found that ATSP/GF laminates with copper foil using ATSP oligomers as adhesive showed a highest average peel strength of 711 N · m−1. Scanning electron microscope (SEM) and Fourier Transform Infrared Spectroscopy (FTIR) showed an excellent bond between the composite and the copper foil interface. Failure occurred between the backside of the copper foil and the ATSP/GF laminates in the peeling test and the mechanism is discussed. Thermogravimetic analyzer (TGA) indicated a thermal stability up to 371°C for ATSP/GF composite substrate and a glass transition temperature of over 400°C as determined by peak in tan δ during Dynamic Mechanical Analysis (DMA).",

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author = "Wenqing Wang and Jacob Meyer and Qingxuan Zeng and Mingyu Li and Bita Vaezian and James Economy",

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AU - Wang, Wenqing

AU - Meyer, Jacob

AU - Zeng, Qingxuan

AU - Li, Mingyu

AU - Vaezian, Bita

AU - Economy, James

PY - 2016/12/1

Y1 - 2016/12/1

N2 - Copper foils are the vital elements used in microelectronic devices. Adequate adhesion between copper foils to various substrates, such as Si, SiO2 and polyimide, is crucial to functional electronic devices. Liquid-crystalline polymers (LCPs) can be used as substrates for these modules as well as the adhesive to copper foils. The adhesion between aromatic thermosetting copolyester (ATSP)/fiberglass fabric (GF) laminates and copper foils was characterized by peel strength tests. It was found that ATSP/GF laminates with copper foil using ATSP oligomers as adhesive showed a highest average peel strength of 711 N · m−1. Scanning electron microscope (SEM) and Fourier Transform Infrared Spectroscopy (FTIR) showed an excellent bond between the composite and the copper foil interface. Failure occurred between the backside of the copper foil and the ATSP/GF laminates in the peeling test and the mechanism is discussed. Thermogravimetic analyzer (TGA) indicated a thermal stability up to 371°C for ATSP/GF composite substrate and a glass transition temperature of over 400°C as determined by peak in tan δ during Dynamic Mechanical Analysis (DMA).

AB - Copper foils are the vital elements used in microelectronic devices. Adequate adhesion between copper foils to various substrates, such as Si, SiO2 and polyimide, is crucial to functional electronic devices. Liquid-crystalline polymers (LCPs) can be used as substrates for these modules as well as the adhesive to copper foils. The adhesion between aromatic thermosetting copolyester (ATSP)/fiberglass fabric (GF) laminates and copper foils was characterized by peel strength tests. It was found that ATSP/GF laminates with copper foil using ATSP oligomers as adhesive showed a highest average peel strength of 711 N · m−1. Scanning electron microscope (SEM) and Fourier Transform Infrared Spectroscopy (FTIR) showed an excellent bond between the composite and the copper foil interface. Failure occurred between the backside of the copper foil and the ATSP/GF laminates in the peeling test and the mechanism is discussed. Thermogravimetic analyzer (TGA) indicated a thermal stability up to 371°C for ATSP/GF composite substrate and a glass transition temperature of over 400°C as determined by peak in tan δ during Dynamic Mechanical Analysis (DMA).

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KW - aromatic thermosetting copolyesters

KW - circuit boards

KW - copper foil

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Adhesion characteristics of aromatic thermosetting copolyester and glass fiber laminates with copper foils for improved circuit boards

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