A simulation study of dual laser beam separation technology for thick transparent inorganic materials

Dual laser beam separation (DLBS) is a novel separating technology developed for KDP crystal with high speed, no contact and excellent separated quality. However, its separating mechanism has not been studied thoroughly and fatal fragmentation always occurred with unknown causes. Meanwhile, there is a lack of research about the material types that DLBS can be adopted. As the real time monitor of 3D stress/strain distribution during separating are difficult, the experimental way to further improve the DLBS is impracticable. In this study, a finite element model was established to achieve a complete understanding of the mechanisms involved in DLBS for transparent inorganic materials. The main behavior of separating stress and the evolution of potential risks during DLBS were analyzed, meanwhile, the influencing mechanisms of critical separating parameters on dynamic temperature and thermal stress distribution were also investigated. Based on these simulation analysis, two significant system improvements for DLBS were put forward, investigated and verified, which improved the separating thickness range, quality, safety and efficiency of DLBS markedly. The simulation results also indicated the material types that DLBS can be adapted to, which have important engineering value for guiding the future application of DLBS technology.